WAT and PCM analysis

Analyze parameters measured during Wafer Acceptance Test (WAT) and Process Control Monitor (PCM) to understand upstream process variation during ramp.

  • Analyze parametric performance across wafers and lots

  • Compare site-to-site test performance across testers

  • Identify fab process variation affecting downstream test yield

  • Correlate WAT and PCM parameters with wafer probe and final test data

Wafer sort analysis

Visualize wafer performance across parametric data, bin distributions, and yield during early production.

  • Wafer map visualization across parametric and bin data

  • Stack and analyze hundreds of wafers simultaneously

  • Detect spatial yield patterns and systematic variation

Site-to-site performance comparison

Identify measurement variation and yield loss across probe sites and test systems during ramp.

  • Compare site performance across wafers and lots

  • Detect recurring site-related yield loss

  • Search historical wafers affected by site variation

Detect test program changes

Identify unintended test program revisions that may affect yield during ramp.

  • Detect program changes even when program names remain unchanged

  • Compare limits, revisions, and added or removed tests

  • Validate program consistency across testers and sites

ANOVA yield analysis

Determine which factors are driving yield and parametric variation during ramp-to-volume.

  • Apply ANOVA across wafers, lots, sites, and test conditions

  • Identify variables impacting yield performance

  • Detect interactions between parameters and operating conditions

CP1 / CP2 wafer sort analysis

Analyze multi-pass wafer sort testing performed under different conditions such as ambient and hot.

  • Compare CP1 and CP2 performance across wafers and lots

  • Detect temperature-dependent yield behaviour

  • Consolidate multi-pass wafer sort datasets for analysis

Gage R&R analysis

Validate measurement repeatability across testers, sites, and probe setups during ramp.

  • Identify tests sensitive to setup variation

  • Verify measurement repeatability across test environments

  • Share Gage R&R results with OSAT and test partners

Rescreen and retest analysis

Monitor retest and rescreen activity across manufacturing partners during ramp.

  • Access raw and rescreened datalogs

  • Analyze retest behavior across wafers and lots

  • Validate adherence to agreed rescreen plans

Cross-stage correlation

Correlate fab, wafer probe, and final test data to understand how upstream variation impacts downstream device performance.

  • Link WAT, CP, and FT results in a unified dataset

  • Trace device performance from fabrication through packaged test

  • Identify early indicators of yield loss during ramp

Supply chain collaboration

Enable shared analysis across fabless companies, foundries, and test houses during production ramp.

  • Secure data sharing with OSATs and foundries

  • Analyze production data across manufacturing partners

  • Accelerate root cause investigation across the supply chain

Transition from ramp to stable production

Once yield stabilizes, engineering focus shifts toward sustaining yield performance and optimizing cost per unit across global production.

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