Auto cleansing of data

Automatically clean final test data using re-screen algorithms so engineers can analyze reliable production datasets.

  • Remove retest noise from final test datalogs

  • Apply automated rescreen rules across production programs

  • Ensure consistent, analysis-ready data for yield investigation

Correlations

Correlate device performance across manufacturing stages to understand how upstream variation impacts production yield.

  • Link fab parameters with wafer probe and final test performance

  • Analyze cross-stage correlations from wafer fabrication to packaged test

  • Identify process variation driving yield excursions

Statistical bin limits

Calculate and manage statistical bin limits to optimize device classification and revenue per wafer.

  • Generate SBL limits interactively from production data

  • Save and reuse statistical limit configurations

  • Evaluate the financial impact of bin distribution changes

Lots-on-Hold dashboard

Monitor material placed on hold due to yield alerts or abnormal production behavior.

  • Add flagged lots to a centralized hold dashboard

  • Track investigation status across engineering teams

  • Support faster lot disposition decisions

Multi-die analysis

Analyze performance relationships between dies within multi-die and advanced packages.

  • Correlate die performance across multi-die devices

  • Link package-level results back to wafer fabrication data

  • Identify die interaction effects impacting yield

Outlier detection

Automatically detect abnormal devices and parameter behavior across large production datasets.

  • Identify statistical outliers across wafers, lots, and tests

  • Apply public-domain and custom detection algorithms

  • Detect early indicators of yield excursions

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