Manage multi-die yield complexity

In chiplet architectures, overall yield is a function of multiple dies, interconnect integrity and assembly quality.

  • Correlate known good die (KGD) data across composite packages

  • Analyze cross-die parametric interaction within assembled modules

  • Detect die-to-die variation before system-level impact

Control advanced packaging defect risk

2.5D and 3D assemblies introduce new failure mechanisms including bump defects, TSV issues and substrate-related variation.

  • Link wafer sort, assembly and final test data seamlessly

  • Monitor yield shifts introduced at packaging stage

  • Support structured root cause analysis across manufacturing stages

Enable automated image defect detection

Advanced packaging relies heavily on X-ray, AOI and other inspection imaging.

  • Integrate image classification and defect tagging into yield analysis

  • Prioritize high-risk defects through AI-assisted review

  • Correlate image signatures with electrical performance outcomes

Maintain end-to-end traceability

High-performance modules require complete genealogy visibility.

  • Track die origin, assembly lot and final test performance

  • Support field return analysis at multi-die level

  • Maintain audit-ready traceability across the full stack

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